High Thermal Conductivity Alumina Ceramic Substrate High Heat Resistance
1. Description
Alumina ceramic is widely used in many fields. Because of its great performance, it is more and more used in curent society, alumina ceramic substrate can meet the requirement of daily using and specifical features.
Ceramic substrate refers to a special process board in which copper foil is directly bonded to the surface of alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate (single or double) at high temperature. The made of ultra-thin composite substrate with excellent electrical insulation properties, high thermal conductivity, excellent solderability and high adhesion strength, and the same as the PCB can be etched a variety of graphics, with a large current carrying ability. Therefore, the ceramic substrate has become the basis of high-power power electronic circuit structure technology and interconnect technology.
2. Main Features
1. Can be made into various of complex shapes, high dimension accuracy.
2. Contact with flame directly,no odor and volatile gases at high temperatures
3. High mechanical strength,resistance to gas flow.
4. Low shrinkage,low thermal conductivity.
5. Excellent strength in high temperature and thermal stability.
3. Specification
| Item | Unit | 95% Alumina ceramic | 99% Alumina ceramic |
| Bulk density | g/cm3 | >3.6 | 3.89 |
| Max use temperature | ℃ | 1500 | 1700 |
| Water absorbtion | % | 0 | 0 |
| Bending Strength | Mpa | 364 | 450 |
| Expansion (25-800°C) | (X10-6/°C) | 7.6 | 8 |
| Thermal Conductivity | (W/(m.R)) | 20 | 35 |
| Dielectric Strength | (kv/mm) | 11 | 12 |
Application:
1. High Power Power Semiconductor Modules; Semiconductor Coolers, Electronic Heaters; Power Control Circuits, Power Hybrid Circuits.
2. Smart Power Components; High Frequency Switching Power Supply, Solid State Relays.
3.Automotive, Aerospace and Military Electronics Components.
4. Solar panel components; telecommunications switches, receiving systems; lasers and other industrial electronics.
